Tu865 achieves flammability class of ul94v0 by incorporating phosphorous and nitrogen compounds. The resin systems in these materials react very slowly at room temperature, giving rise to working times of many days or months. Before use, read the operating manual carefully or consult with your dealer or our sales. Data sheet high reliability glass epoxy multilayer materials.
Data sheet datenblatt npg170r, npg170tl, npg170b rev. The foil column is for a prepreg sheet that is in contact with the outer layer foil. The prepreg exceeding shelf time should be retested. Ventec can supply either reverse treated rt or double side treated copper foil. Its design for high layer pcb and can pass 260 lead free assembly and sequential lamination process. Grain direction is shown on the certificate of conformance. The resin is predried, but not hardened, so that when it is heated, it flows, sticks, and is completely immersed. Glass transition temperature tg by dsc tma spec min. The name of each prepregs derives from the type of fibreglass used. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive. Toughened bismaleimide resin for advanced composites.
High strength, damageresistant, structural epoxy matrix. Tu86p hf tu862 hftu86p hf hitg halogen free materials are made of epoxy resin and eglass fabric. E high luminance of multifunctional epoxy contrast with cop leadfree compatible per for a. Careful design of the inner layer construction with high resin percentage prepreg will ensure a void free press package. Midtoughened, high strength,damageresistant, structural epoxy matrix. Copper clad laminate department glass cloth base epoxy resin no. This specification covers ansi fr4 thin laminate for use in manufacture of. Prepreg type, resin content and size could be available upon request. Laminate r5775 prepreg r5670 data sheet high speed, low loss multilayer materials jun.
Tu662 tu66p laminate prepreg are made of high quality woven eglass coated with the epoxy resin system, which provides the laminates uvblock characteristic, and compatibility with automated optical inspection aoi process. Polyimide laminate and prepreg 85n is the ultimate polyimide and laminate prepreg system fo pwbs requiring resistance to high temperature, both in process and in enduse applications. The products in the datasheet are electronic circuit board materials for electronic and electrical devices. Typically a printed circuit manufacturer would use 7628 prepreg, a low cost, high volume type material. It is intended for multilayer printed wiring board pwb applications where demanding thermal performance and high reliability are required. Core constructions are different depending on the region and oem spec.
Prepreg requirements v0 minimum specificationwoven eglass 1,50as per ipc4412 or aabus 1,50 v0 thermal resistance. Tu865 is also available for singledouble sided application. Introduction with this product information, we would like to supply you with basic details about the structural options, tolerances, materials and layout guidelines for multilayer boards. We would like to have a delivery specifications mutually agreed for the product that you have decided to use. All standard high performance prepreg resin systems can be combined with a wide range of woven and multiaxial technical fabrics and fibres based on glass fibre, carbon fibre and aramid fibre, as well as other specialty fibres and hybrid fabrics to suit application and performance needs. The signal category represents a sheet of prepreg in contact with copper area of. Polyimide laminate and prepreg 85n is the ultimate polyimide and laminate and prepreg system for pwbs requiring resistance to high temperature, both in process and in ende auson batcppomee cr. Tu865p is prepreg designed for use with tu865 laminate for making multilayer printed wire boards. Data sheet high speed, low loss multilayer materials. Unlike conventional fr4 material using brominated resin as flame retardant, tu862 hftu86p hf achieves flammability class of ul94v0 by incorporating nitrogen compounds in the materials. Panasonic electric works reserve the right to change these typical values as a natural process of refering our test equipment and technics. If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed. Improved signal integrity through impedance matched circuit boards.
Tu768 tu768p laminate prepreg are made of high quality woven eglass coated with the epoxy resin system, which provides the laminates with uvblock characteris tic, and compatibility with automated optical inspection aoi process. Low cte high tg material em827i em827bi basic laminate property low zaxis cte low moisture absorption excellent caf resistance excellent thermal stability for leadfree processing for automotive application and other applications with caf resistance concern mostly item ipctm650 test condition unit typical value. Prepreg consistency resin content control, on line cure monitoring, redundancy. Prepregs are thus fibreglass strengthened by an adhesive layer similar to fr4 material. Please do not use them for other than specified use. All datasheet properties are for laminate with 7628 glass style. Information contained in this data sheet represents typical or average values and does not constitute any. Click here to view data sheets for the european fabrics range. Take care in handling thin core laminates as they are easily damaged. Brominefree chemistry provides bestinclass thermal stability for applications with sustained high inuse temperatures as well as for use in. Data sheet high reliability glass epoxy multilayer. Please see the example below for a job that requires two. Class cm keeping the core and prepreg in the same grain direction is crucial to ensure the flatness of multilayer boards. Glass style resin volume content fiber volume content 1027 0.
A global manufacturer of highperformance base materials. Is400 laminate and prepreg products are manufactured using isolas patented technology, reinforced with. Most laminate and all prepreg in complex pcbs have a low volume fraction of glass i. Tu662 midtg and high thermal reliability laminate and prepreg core. Recent listings manufacturer directory get instant insight into any electronic component. Polyimide laminate and prepreg 35n is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. Tu768 tu768p laminate prepreg are made of high quality woven eglass coated with the epoxy resin system, which provides the laminates with uvblock characteristic, and compatibility with automated. Material is available in both long and short grain. Interconnection stress test result test condition 6l pcb i,ooo cycles thickness i. The material is compatible with the aoi process and exhibit the uvblock characteristic. Prepreg properties will maintained for 3 months when keep it under 23.
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